2024-12-09

What are the packaging forms of LED?

What are the packaging forms of LED?

LED packaging forms are diverse, mainly including the following:

  • ‌ Pin type (Lamp-LED) package ‌ :
Using the lead rack as the pin, it is the first package structure to be put on the market.
Commonly used 3 ~ 5mm package structure, low power, mainly used for instrument display or indication ‌.
  • ‌ Surface Mount (SMD-LED) package ‌ :
Attached to the circuit board surface, suitable for SMT processing, high market share.
Solve the problems of brightness, viewing Angle, flatness, light weight, small size ‌.
  • ‌ Chip on Board (COB) package ‌ :
Attach multiple LED bare chips directly to the PCB board, and then seal.
The support is omitted, the process is simple, and the display screen is not grainy ‌.
  • ‌ Power type LED package ‌ :
LED chips and packages are developing in the direction of high power, with large luminous flux and effective heat dissipation.
LED packages that can withstand several watts of power are available for solid lighting sources ‌.
  • ‌ TOP-LED package ‌ :
The top is luminous, the surface is flat, mainly used for the ultra-thin mobile phone and PDA backlight and status indicator ‌.
  • ‌ Side-LED package ‌ :
Side light, using the mirror principle to convert the surface light into side light.
Suitable for LCD backlight source, successfully applied to large size LCD backlight module ‌.
In addition, there are other packaging forms such as chip on glass package (COG), glue on board package (GOB), and system package (SiP) LED package and chip bonding, chip bonding and other packaging technologies.

The difference between Lamp-LED, TOp-LED, Side-LED, SMD-LED, High-power-LED?

  • ‌Lamp-LED (vertical LED) ‌ :
Package form: Potting, first injected liquid epoxy resin, then inserted into the pressure welded LED bracket, after curing molding.
Features: simple manufacturing process, low cost, high market share, mostly straight-insert ‌.
  • ‌TOP-LED ‌ :
Luminous mode: The top is luminous, the surface is flat.
Application: Mainly used in multi-function ultra-thin mobile phone and PDA backlight and status indicator ‌.
  • ‌ side-LED (Side emitting LED) ‌ :
Luminous mode: side luminous.
Features and application: Suitable for LCD backlight source, using the principle of reflector to convert surface light into side light, successfully applied to large size LCD backlight module ‌1.
  • ‌SMD-LED (Surface Mount LED) ‌ :
Package form: attached to the surface of the circuit board, suitable for SMT processing.
Features: Solve the problems of brightness, viewing Angle, flatness, light weight, small size, high reliability ‌.
  • ‌ high-power-LED (High power LED) ‌ :
Features: high power, high brightness, wide irradiation range.
Application: mainly used for outdoor lighting, such as street lights, car lights, etc., high light efficiency, power saving ‌.
In summary, these five types of LED packaging forms have significant differences in luminous mode, packaging characteristics, application fields, etc., and users can choose the right type of LED according to their specific needs.
Do you want to know more about LED packaging?Let us know by leaving a message us LIEKLIGHT Phone:+86-755-23328395, Email :contact@like-light.com,Wechat/WhatsApp:86-132-66666-320,Bring you more knowledge.