2024-01-18
Blu-ray inversion VS CSP, Who is the future of COB technology?
Blu-ray inversion VS CSP, Who is the future of COB technology?
There are two mainstream flip COB technologies on the market: one is the flip CSP chip combination technology that first sprays phosphor, turns white light, and then onto the substrate; The second is the COB technology in which the blue chip is affixed first and then the phosphor is sprayed.
Flip blue light temporarily ahead of the final or will take the differentiated application route.
At present, the reverse Blu-ray chip combination and CSP chip combination maturity is not the same, which is better or worse, it is not good to judge." Dr. Mo Qingwei, vice president of de Hau Runda, believes that in the future for a long time, the flip blue chip will be the mainstream.
In fact, for the two technologies, the bottom line is still CSP and flip Blu-ray chips. In terms of the development of these two chip technologies, the flip Blu-ray chip is several years earlier than the development of CSP. At present, the flip Blu-ray chip technology has gradually matured, and many companies have launched products. However, although CSP technology has products, it is still in an early stage. Therefore, Dr. Mo Qingwei believes that Blu-ray flip COB will be the mainstream in the future for a long time and also fits the current development status of these two technologies.
Of course, the development of any product or technology is linked to the market, so there is no absolute thing. As Dr. Lu Jinyu, deputy general manager of Londa's electronic marketing business group, believes.
The flip COB will be different due to the different attributes of the flip package architecture, the connection to the COB substrate selection is also different, and the advantages of its specifications and production are different, but each has technical advantages and needs to overcome the project that can still be improved at this stage.
However, in terms of connecting with the market, although Londa Electronics has the mass production capacity of both processes, how to determine the technology that is more suitable for COB is to choose the development plan from the perspective of meeting the customer's finished product design and production.
So it is hard to say which technology is better, more depends on customer needs. Of course, whether the technology itself ADAPTS to customer needs also depends on whether the technology can be better. In this regard, Wen Jianhua, senior vice president of Pu Rui Optoelectronics Asia, said that the application market of the two technologies is completely different. Because the surface light source composed of CSPLED has obvious disadvantages in light distribution, the uniformity of the spot and the consistency of the color are difficult to compare with the flip blue chip, and the flexibility of CSP is relatively low. However, with the development of technology, the cost advantage of CSP will gradually emerge. Therefore, the COB of CSP will be more as a customized module of CSP factory for customers, used in the field of general lighting.
In fact, for the two technologies, the bottom line is still CSP and flip Blu-ray chips. In terms of the development of these two chip technologies, the flip Blu-ray chip is several years earlier than the development of CSP. At present, the flip Blu-ray chip technology has gradually matured, and many companies have launched products. However, although CSP technology has products, it is still in an early stage. Therefore, Dr. Mo Qingwei believes that Blu-ray flip COB will be the mainstream in the future for a long time and also fits the current development status of these two technologies.
Of course, the development of any product or technology is linked to the market, so there is no absolute thing. As Dr. Lu Jinyu, deputy general manager of Londa's electronic marketing business group, believes.
The flip COB will be different due to the different attributes of the flip package architecture, the connection to the COB substrate selection is also different, and the advantages of its specifications and production are different, but each has technical advantages and needs to overcome the project that can still be improved at this stage.
However, in terms of connecting with the market, although Londa Electronics has the mass production capacity of both processes, how to determine the technology that is more suitable for COB is to choose the development plan from the perspective of meeting the customer's finished product design and production.
So it is hard to say which technology is better, more depends on customer needs. Of course, whether the technology itself ADAPTS to customer needs also depends on whether the technology can be better. In this regard, Wen Jianhua, senior vice president of Pu Rui Optoelectronics Asia, said that the application market of the two technologies is completely different. Because the surface light source composed of CSPLED has obvious disadvantages in light distribution, the uniformity of the spot and the consistency of the color are difficult to compare with the flip blue chip, and the flexibility of CSP is relatively low. However, with the development of technology, the cost advantage of CSP will gradually emerge. Therefore, the COB of CSP will be more as a customized module of CSP factory for customers, used in the field of general lighting.
CSP inversion is good, but there are many thresholds.
This is the current status quo, but it does not mean that the technical gap between CSP is very large. In fact, from the development of LED, the maturity cycle of new technology is getting shorter and shorter, and the new technology has advantages that the previous generation of technology can not do. In this regard, Zheng Haibin, deputy general manager and marketing director of Jiangxi Zhaochi Optoelectronics, said that the CSP chip combination will be more in the form of module modules, which is relatively flexible in application convenience and can be widely used in LED products. Flip COB products are mainly used in the downlight part is relatively common, in the LED application market will have some crossover, at present, the CSP module relative to the application part is slightly dominant, but a large number of popularity also depends on the future CSP chip module and flip COB cost performance.
CSP does have its advantages, but there are also some problems. In this regard, Hongli Photoelectric Relinen said, "At present, the CSP combined COB process is extremely simple, high production efficiency, but the light color consistency is poor; The flip blue chip combination light color consistency is good, the process is relatively mature, easy to achieve."
That's exactly what Fang Ning, Luminus' vice president of sales in China, thinks. These two combinations, from the cost point of view, CSP chip can be a large number of standardized production and then flexible combination, applicability will be higher than the flip blue chip COB, but there will be a small difference in the color consistency of each single point of CSP, resulting in the final through the secondary optics effect is poor; The principle and optical design of inverted blue chip COB are basically the same as that of formal COB, which can maximize the use of existing optical components and obtain the same clean light output as the current formal COB.
In addition to the color consistency problem, Yin Hui, deputy general manager of Rising spectrum Optoelectronics, also added that although these two forms of technology are a trend in the development of LED packaging, they are relatively large in equipment investment, especially CSP is more completed in the chip factory, so small-scale packaging companies are more cautious when investing. These two products are very potential products, but the market acceptance and application still need time to digest.
CSP does have its advantages, but there are also some problems. In this regard, Hongli Photoelectric Relinen said, "At present, the CSP combined COB process is extremely simple, high production efficiency, but the light color consistency is poor; The flip blue chip combination light color consistency is good, the process is relatively mature, easy to achieve."
That's exactly what Fang Ning, Luminus' vice president of sales in China, thinks. These two combinations, from the cost point of view, CSP chip can be a large number of standardized production and then flexible combination, applicability will be higher than the flip blue chip COB, but there will be a small difference in the color consistency of each single point of CSP, resulting in the final through the secondary optics effect is poor; The principle and optical design of inverted blue chip COB are basically the same as that of formal COB, which can maximize the use of existing optical components and obtain the same clean light output as the current formal COB.
In addition to the color consistency problem, Yin Hui, deputy general manager of Rising spectrum Optoelectronics, also added that although these two forms of technology are a trend in the development of LED packaging, they are relatively large in equipment investment, especially CSP is more completed in the chip factory, so small-scale packaging companies are more cautious when investing. These two products are very potential products, but the market acceptance and application still need time to digest.
