2024-01-08
CSP/EMC/COB and other 6 major packaging technologies
CSP/EMC/COB and other 6 major packaging technologies
1, CSP chip level package
When it comes to the most popular LED technology, it is CSP. CSP has attracted much attention because it carries the industry's requirements for package miniaturization and the expectation of cost-effective improvement. At present, CSP is gradually being used in mobile phone flash, display backlight and other fields.
In short, at this stage, the domestic CSP chip package is still in the research and development period, and will develop along the track of improving the cost performance. With the continuous release of the scale effect of CSP products, the cost performance will be further improved, and more and more lighting customers will accept CSP products in the next two years.
In short, at this stage, the domestic CSP chip package is still in the research and development period, and will develop along the track of improving the cost performance. With the continuous release of the scale effect of CSP products, the cost performance will be further improved, and more and more lighting customers will accept CSP products in the next two years.
2. Remove the power module
In recent years, "de-power" has developed in full swing, so what is "de-power"? "Power" is to build the power supply, reduce electrolytic capacitors, transformers and other parts of the device, the drive circuit and LED lamp beads share a substrate, to achieve a high degree of integration of the drive and LED light source. Compared with the traditional LED, the power supply solution is simpler, easier to automate and mass production; At the same time, it can reduce the size and reduce the cost.
3, flip LED technology
"Flip chip + chip level package" is a perfect combination. With the advantages of high density and high current, inverted LED has become a hot spot of LED chip enterprise research and the mainstream direction of LED industry development in the past two years.
The current CSP package is based on flip technology. Compared with the formal, the inverted LED eliminates the link of gold wire, which can reduce the probability of dead lights by more than 905, ensuring the stability of the product and optimizing the heat dissipation capacity of the product. At the same time, it can also withstand larger current drives, obtain higher luminous flux and thin characteristics on a smaller chip area, making it the best solution for ultra-current drives in lighting and backlight applications.
The current CSP package is based on flip technology. Compared with the formal, the inverted LED eliminates the link of gold wire, which can reduce the probability of dead lights by more than 905, ensuring the stability of the product and optimizing the heat dissipation capacity of the product. At the same time, it can also withstand larger current drives, obtain higher luminous flux and thin characteristics on a smaller chip area, making it the best solution for ultra-current drives in lighting and backlight applications.
4, EMC packaging
EMC refers to epoxy plastic sealing material, which has the characteristics of high heat resistance, UV resistance, high integration, high current, small size and high stability. It has outstanding advantages in the field of bulb lamps with demanding heat dissipation requirements, outdoor lamps with relatively high UV resistance requirements and backlight fields requiring high stability.
It is understood that EMC currently mainly has 3030, 5050, 7070 and other models, of which 3030 has been quite prominent. In 2015 light Asia exhibition, 3030 packaging products can be seen everywhere, in addition to domestic Ruifeng, Smad, Hongli, Tiandian and 100 million light, as well as Osram, Seoul and other international coffee layout 3030.
It is understood that EMC currently mainly has 3030, 5050, 7070 and other models, of which 3030 has been quite prominent. In 2015 light Asia exhibition, 3030 packaging products can be seen everywhere, in addition to domestic Ruifeng, Smad, Hongli, Tiandian and 100 million light, as well as Osram, Seoul and other international coffee layout 3030.
5, high voltage LED package
At present, the LED price war is fierce, and the power supply accounts for a prominent proportion in the cost of the LED whole lamp, and how to save the drive cost has become the focus of LED drive power supply enterprises. High-voltage leds can effectively reduce power costs and are identified as one of the future development trends of the industry.
At present, the common approach to improve LED brightness is to enlarge the chip size or increase the operating current, but it is not easy to fundamentally solve the problem, and may even cause new problems, such as uneven current, poor heat dissipation, Droop Effect, etc., but the high-voltage chip provides the best solution.
The principle of the high-voltage chip is actually to use the concept of breaking the whole into pieces, breaking the larger chip into a small chip with high light efficiency and uniform light, and integrating it through semiconductor process technology, so that the area of the chip can be fully utilized and the purpose of brightness improvement can be achieved more effectively. From the perspective of the whole lamp (such as street lights), the high-voltage chip with the IC power supply, the voltage difference under the power supply becomes smaller, in addition to increasing the service life, it can also reduce the cost of the system.
At present, the common approach to improve LED brightness is to enlarge the chip size or increase the operating current, but it is not easy to fundamentally solve the problem, and may even cause new problems, such as uneven current, poor heat dissipation, Droop Effect, etc., but the high-voltage chip provides the best solution.
The principle of the high-voltage chip is actually to use the concept of breaking the whole into pieces, breaking the larger chip into a small chip with high light efficiency and uniform light, and integrating it through semiconductor process technology, so that the area of the chip can be fully utilized and the purpose of brightness improvement can be achieved more effectively. From the perspective of the whole lamp (such as street lights), the high-voltage chip with the IC power supply, the voltage difference under the power supply becomes smaller, in addition to increasing the service life, it can also reduce the cost of the system.
6, COB integrated package
COB integrated light source because it is easier to achieve dimming color, anti-glare, high brightness and other characteristics, can well solve the problem of color difference and heat dissipation, is widely used in the field of commercial lighting, by many LED packaging manufacturers favor.
At this stage, COB is facing the process of customization, and the future COB market will develop in the direction of standardized products. Because the supporting facilities of the upstream and downstream COB are relatively mature and the cost performance is high, once the universality is solved, the scale will be further accelerated.
At this stage, COB is facing the process of customization, and the future COB market will develop in the direction of standardized products. Because the supporting facilities of the upstream and downstream COB are relatively mature and the cost performance is high, once the universality is solved, the scale will be further accelerated.
