2024-01-06
LED package form
LED package form
According to the different application occasions, the different shape scale, the heat dissipation plan and the luminous effect. LED packaging in a variety of ways. At present, leds are mainly classified as Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, Flip Chip-LED and so on
Lamp-LED(Vertical LED)
The early Lamp-LED was a direct-plug LED, and its package was potting. The process of potting is to first inject liquid epoxy resin into the LED molding cavity, and then Pierce the pressed welded LED bracket, put it in the oven to let the epoxy resin cure, and then the LED is detached from the mold cavity and formed. Due to the relatively simple production process and low cost, it has a high market share.
SMD-LED(Patch LED)
Patch LED is attached to the surface of the circuit board, suitable for SMT processing, reflow soldering. The brightness, Angle of view, flatness, reliability, consistency and other problems are well dealt with, the selection of lighter PCB board and reflector material, and the improvement removes the heavy carbon steel material pin of the direct insertion LED, so that the reflection layer needs to be filled with less epoxy resin, the intention is to reduce the scale and reduce the weight. In this way, the chip LED can easily reduce the product weight by half, and ultimately make the use more complete.
Side-led (Side emitting LED)
At present, the other side of the LED package is the light-emitting package. If you want to use LED as the backlight source of LCD(liquid crystal display device), then the side of the LED light needs to be the same as the surface light, in order to make the LCD backlight uniform. Although the depiction of the wire frame can also reach the intention of the side light, the heat dissipation effect is not good. However, Lumileds has successfully applied high-power leds to large-scale LCD backlight modules by creating the depiction of mirrors that emit light on the outside, using the principle of mirrors to generate side light.
Top-led (TOP light emitting LED)
Top light emitting LED is a more common patch type light emitting diode. It is mainly used in the backlight and status indicator in multi-functional ultra-thin mobile phones and PDAs.
Top-led (TOP light emitting LED)
Top light emitting LED is a more common patch type light emitting diode. It is mainly used in the backlight and status indicator in multi-functional ultra-thin mobile phones and PDAs.
High-power-led (High-Power LED)
In order to obtain high-power and high-brightness LED light sources, manufacturers are developing high-power directions in LED chips and package descriptions. At present, LED packages that can accept several watts of power have been presented. For example, the package layout of the Norlux series of high-power LED is a hexagonal aluminum plate as the base (so that it is non-conductive) multi-chip combination, the base diameter of 31.75mm, the light emitting area is located in the middle of the heart, the diameter of about (0.375×25.4)mm, can contain 40 LED cores, aluminum plate is also used as heat sink. This package uses the conventional tube core high-density combination package, high luminous power, low thermal resistance, high light output power at large current, and is also a promising LED solid light source.
It can be seen that the thermal characteristics of power-type LED directly affect the working temperature, luminous power, luminous wavelength, service life, etc., therefore, the packaging description and production skills of power-type LED chip become more and more important.
It can be seen that the thermal characteristics of power-type LED directly affect the working temperature, luminous power, luminous wavelength, service life, etc., therefore, the packaging description and production skills of power-type LED chip become more and more important.
Flip Chip-LED(Crystal covered LED)
LED crystal packaging layout is basically made of a plurality of perforations in the PCB, each perforation on one side of the substrate is provided with two different areas and open circuit of each other conductive raw material, and the conductive raw material is laid on the surface of the substrate, there are a plurality of unpackaged LED chips placed on each perforation on the side of the conductive raw material, The positive and negative contacts of a single LED chip are connected with the conductive material on the surface of the substrate using a tin ball, and the surface of a plurality of LED chips facing the perforation is dotted with a transparent material sealant, which is located in the shape of a half ball at each perforation. Attributed to the inverted welding layout LED.
LED luminous principle
Leds convert electrical energy directly into light energy. The heart of the LED is a semiconductor chip, and one end of the chip is attached
The LED lamp is on a stand, which is the negative electrode, and the other end is connected to the positive electrode of the power supply, and the entire chip is encapsulated by epoxy resin. A semiconductor chip consists of two parts, one is a P-type semiconductor, in which holes dominate, and the other is an N-type semiconductor, on which are mainly electrons. But when the two semiconductors are connected, a "P-N junction" is formed between them. When the current is applied to the chip through the wire, the electrons are pushed to the P region, where the electrons are combined with the holes, and then the energy is emitted in the form of photons, which is the principle of LED light. The wavelength of light determines the color of light, which is determined by the material forming the P-N junction.
The LED lamp is on a stand, which is the negative electrode, and the other end is connected to the positive electrode of the power supply, and the entire chip is encapsulated by epoxy resin. A semiconductor chip consists of two parts, one is a P-type semiconductor, in which holes dominate, and the other is an N-type semiconductor, on which are mainly electrons. But when the two semiconductors are connected, a "P-N junction" is formed between them. When the current is applied to the chip through the wire, the electrons are pushed to the P region, where the electrons are combined with the holes, and then the energy is emitted in the form of photons, which is the principle of LED light. The wavelength of light determines the color of light, which is determined by the material forming the P-N junction.
