2024-02-26

LED integrated package features

Integrated package, also known as polycrystalline package, is based on the size of the required power to determine the number of LED chips on the substrate base, can be combined into 1W, 2W, 3W and other high-brightness high-power LED devices, and finally, the use of high-refractive index materials according to the shape of the optical design of the chip for packaging.
The unique packaging principle of integrated packaging determines that it has many advantages, such as:
(1) As far as China is concerned, the research and development of high-power chips is in a backward position, and the use of integrated packaging is a shortcut to development, which is more in line with China's basic national conditions;
(2) The chip can be designed in series or parallel, flexibly adapt to different voltages and currents, facilitate the design of the driver, improve the light efficiency and reliability of the light source;
(3) The number of chips on a certain area of the substrate can be freely controlled, according to customer requirements, can be packaged into a point light source or surface light source, in various forms;
(4) The chip is directly connected to the substrate, which reduces the thermal resistance of the package and makes the heat dissipation problem easy to deal with.
However, for integrated packaging, there are also some shortcomings:
(1) Due to the multi-chip integrated package on a substrate, resulting in a larger light source volume;
(2) Multiple chips are combined in series and parallel, which has poor reliability compared with a single chip, which will cause the overall light source to be affected;
(3) Although the multi-chip package has a strong heat dissipation capacity compared with a single chip with the same power, due to the simultaneous heat dissipation of multiple chips, the heat loss degree is different, which will cause the temperature between the chips to be different, affecting the life, so the heat dissipation problem is also very critical;
(4) The design problem of secondary optics, multi-chip light Angle is different, it is necessary to carry out secondary optical design on the basis of primary optical design to meet the requirements of users.