2024-01-26

LED optical integrated packaging technology

(1)COB integrated package

COB integrated package existing MCOB, COMB, MOFB, MLCOB and other more than 30 kinds of package structure forms, COB packaging technology is becoming more and more mature, its advantage is low cost. COB package now accounts for about 40% of the LED light source market, light efficiency up to 160~178 lm/w, thermal resistance up to 2℃/w, COB package is the recent development trend of LED packaging.

(2)LED crystal level package

Wafer level package from the epitaxial LED device as long as a slice, is the LED lighting source requirements of the multi-system integration package form, the general substrate using silicon material, without solid crystal and pressure welding, and dispensing molding, the formation of system integration package, its advantages are good reliability, low cost, is one of the development directions of packaging technology.

(3)COF integrated package

COF integrated package is a large-area assembly of power LED chip on the flexible substrate, it has the advantages of high thermal conductivity, thin layer flexibility, low cost, uniform light output, high light efficiency, flexible surface light source, etc., can provide line light source, surface light source and three-dimensional light source of various LED products, but also can meet the requirements of LED modern lighting, personalized lighting. It can also be used as a general-purpose package component, and the market prospect is promising.

(4)LED modular integrated package

Modular integrated package generally refers to the LED chip, drive power, control part (including IP address), parts and other system integration package, collectively referred to as the LED module, with saving materials, reducing costs, can be standardized production, easy maintenance and many other advantages, is the direction of LED packaging technology development.

(5) Crystal encapsulation technology

Crystal encapsulation technology is composed of chip, substrate, convex block to form a space, so that the packaged chip has the advantages of small size, high performance, short connection, using ceramic substrate, crystal chip, eutectic process, direct pressing to achieve high power lighting performance requirements. The chip is pressed on the substrate with gold-tin alloy instead of the previous silver glue process, and the "direct pressing" replaces the past "reflow welding", which has excellent conductive effect and thermal conductivity area. The packaging technology is an important development trend of high-power LED packaging.

(6) package-free chip technology

Packaging free technology is a technology integration, the use of flip chip, without solid crystal glue, gold wire and bracket is one of the 70 processes of semiconductor packaging technology. The light efficiency of PFC free packaging chip products can be increased to 200lm/w, the light Angle is greater than 300 degrees of ultra-wide Angle full circle light design, do not use secondary optical lenses, will reduce the loss of light efficiency and reduce costs, but to invest in expensive equipment. PFC new products focus on the LED lighting market, especially in candle lamps, which can not only simulate the shape of tungsten lamps, but also break through the limitation of heat dissipation volume.

(7)LED other packaging structure forms

①EMC package structure: is Embedded integrated package form (Embedded LED Chip) will not directly see the LED light source.
②EMC packaging technology: (Epoxy Molding Compound) with epoxy molding compound as the support packaging technology, with high heat, high integration, UV resistance, small size and other advantages, but the air tightness is poor, has been mass production.
③COG package: (Chip On Glass) Put the LED chip on the glass substrate for packaging.
④QFN packaging technology: When the small-pitch display pixel unit is less than or equal to P.1, the packaging form used will replace the PLCC structure, and the market prospect is promising.
(5) 3D packaging technology: The technology of packaging in three-dimensional form is under development.
Power Frame Package technology: (Chip-in-Frame package) package power LED chips on a small frame, industrial light efficiency has reached 160~170 lm/w, up to 200 lm/w or more.