1. Light emitting chip (LED chip)

• Materials: Aluminum gallium nitride (AlGaN) is usually used, which can emit light efficiently in the ultraviolet band (200-280nm).
• Structure: multi-layer structure, including substrate, buffer layer, N-type layer, quantum well, P-type layer, etc.

2. Substrate

• Materials: sapphire (Al₂O₃), silicon (Si) or silicon carbide (SiC) are commonly used, which affects the heat dissipation and luminous efficiency of the chip.
• Features: sapphire low cost, but poor thermal conductivity; Silicon carbide conducts heat well, but costs a lot.

3. Packaging materials

• Material: Commonly used quartz glass or high borosilicate glass, can efficiently transmit UVC light.
• Features: quartz glass has high transmittance, high temperature resistance, but high cost; High borosilicate glass has lower cost, but slightly poor light transmittance.

4. Heat dissipation structure

• Material: Commonly used aluminum or copper, to ensure the chip heat dissipation, prolong the life.
• Structure: including heat sink, heat sink, etc., the design should consider the heat dissipation efficiency and space limitation.

5: Electrodes

• Material: Commonly used gold (Au) or silver (Ag) to ensure stable current transmission.
• Structure: including positive and negative electrodes, which need to be in good contact with the chip to reduce resistance.

6. Packaging adhesive

• Material: Commonly used silica gel or epoxy resin to protect the chip and improve light efficiency.
• Features: silicone high temperature resistance, anti-aging; Epoxy resin is low cost, but poor heat resistance.

7. The reflector

• Material: Commonly used aluminum or silver, improve the utilization rate of UVC light.
• Structure: Located at the bottom or side of the chip to reflect light and improve output efficiency.